SUNSHINE TB-03S Infrared Thermal Imaging Analyzer Phone PCB Motherboard Fault Problem Diagnostic Tool

• Support multi-platform client connections such as IP mobile phones, Android mobile phones, and laptops
• The infrared lens is detachable and can be installed on the microscope through a special bracket
• The bracket can be flexibly stretched to adjust the height, which is convenient for storage, comprehensively improves the user experience, and meets the needs of different scenarios
• It is a single-light infrared thermal imaging detection tool suitable for the maintenance of mobile phone motherboards. It can quickly locate PCB short circuit and leakage fault components, supports multi-platform use, and can efficiently solve the problems of low efficiency and difficult operation of traditional leakage detection
• Function: infrared quick diagnosis, infrared lens detachable, support APP/PC, high-definition thermal imaging, precise positioning, HD thermal imaging, multi-platform connection, one machine with multiple functions, telescopic adjustment

Specification:

• Model: TB-03S
• Net Weight: about 265g
• Height: 270mm
• Detector Type: Uncoiled Vanadium Oxide (VOx) Detectors
• Resolution: 256*192
• Wavelength range: 7.5~13.5um
• Camera angle: 25 degree*18 degree
• Display mode: Visible Light/Thermal Imaging/Quick Check
• Connection method: Type-C
• Image storage format: JPG
• Input supply voltage: 5V DC
• Power consumption: 2.5W
• Storage temperature range: -20-60 Celsius degree
• Operation range: 3-45 Celsius degree
• Humidity: 95% relative humidity
• Temperature measurement distance: 5~25cm
• Temperature measurement accuracy: +5 Celsius degree or +5% (Max)
• Temperature  range: -20~550 Celsius degree
• Install: Plug and play, no installation required