RELIFE RL-601MA A8-A15 CPU Reballing Stencil Platform for iPhone 6-13 Pro Max IC Chip Planting Tin Template Fixture
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Item No.: 661600618A Ships in 1 - 3 days MOQ: 1
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Specifications
- Gross Weight :0.185kg
- Volume Weight :0.048kg
- Length :9.500cm
- Width :9.000cm
- Height :2.500cm
- Weight :0.165kg
- EAN :
- With Retail Packaging :Yes
Product Description
RELIFE RL-601MA A8-A15 CPU Reballing Stencil Platform for iPhone 6-13 Pro Max IC Chip Planting Tin Template Fixture
- Using a new type of magnetic power original positioning, strong magnetic automatic camping convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping
- Various models, suitable for A8 / A9 / A10 / A11 / A12 / A13 / A14 / A15
- Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged
- General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil)
Specifications:
- Brand: RELIFE
- Product: CPU Reballing Stencil Platform
- Model: RL-601MA
- Net weight: about 130g
- Gross weight: 150g
- Size: 55*70*14mm
- Steel Stencil Thickness: 0.12mm
Note: Manual measurement will have ± tolerance, for reference only, please refer to the actual product.
Package included:
- 1 x Fixture
- 8 x Steel Mesh