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RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools
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Item No.: 661601013A Ships in 1 - 3 days MOQ: 1
| 1+ units | 2+ units | 8+ units | 16+ units | 32+ units |
| $45.21 | $44.50 | $43.08 | $41.65 | $40.93 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Gross Weight :0.157kg
- Volume Weight :0.011kg
- Length :5.000cm
- Width :5.000cm
- Height :2.000cm
- Weight :0.140kg
- EAN :
- With Retail Packaging :Yes
Product Description
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools
- Support Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series. Applicable to ACU/EMMC/EXC/HIC/MTC/SMC series, etc.
- Use mobile phones for actual measurement to ensure accuracy. Each mesh is calibrated according tothe mobile phone drawings to ensure that every solder joint is indispensable
- It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
- UItra thin design, better fit of tin planting, continuous bending and full toughness
Specifications:
- Product: Android series chip planting tin steel stencil set
- Model: RL-044
- Net weight: about 130g
- Size: 50 * 50 * 0.12/0.15mm
- Thickness: 0.12 /0.15mm (EMMC series)
- Quantity: 58pcs/box
Package included:
- 4 x ACU
- 6 x EMMC
- 9 x HIC
- 11 x MTC
- 21 x SMC
- 7 x EXC
- Other items not included
