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MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
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Item No.: 6616001326A Ships in 1 - 3 days MOQ: 1
| 1+ units | 2+ units | 7+ units | 18+ units | 36+ units |
| $14.30 | $14.08 | $13.86 | $13.41 | $13.19 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Gross Weight :0.090kg
- Volume Weight :0.027kg
- Length :7.800cm
- Width :7.700cm
- Height :2.000cm
- Weight :0.080kg
- EAN :
- PackageLength :0.000cm
- PackageWidth :0.000cm
- PackageHeight :0.000cm
- PackageQuantity :0
- With Retail Packaging :No
Product Description
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
- 【Wide Compatibility】Suitable for chips up to 20 x 18.5mm, accommodating most common chip sizes for versatile application
- 【Adjustable Temperature】Precise heat control from 160°C to 250°C prevents chip damage from overheating or improper temperature settings
- 【Effortless Desoldering】Eliminates the need for soldering wire, allowing easy removal of solder and adhesive with a single wipe for quick and convenient tinning
- 【Pad Protection】Avoids repeated scraping with soldering irons, preserving the integrity of the pad surface during the desoldering process
- 【Safe and Efficient】Features a low-voltage heating plate for rapid heating without electrical leakage or static discharge, ensuring safer operation
- 【User-Friendly Design】Incorporates hidden screws and flexible telescopic clamping to prevent residue accumulation, enhancing durability and ease of use
Specifications:
- Product Name: SL-2 CPU Chip Desoldering Platform
- Compatible Chip Size: Up to 20 x 18.5mm
- Temperature Range: 160°C - 250°C
- Heating Method: Low-voltage heating plate
Compatible with:
- Universal
Package included:
- 1 x Chip Heating Desoldering Platform
