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LANRUI P08 Explosion-Proof Solder Tin Gasket 20x20mm High Temperature Resistant Soldering Pad for Phone CPU IC Chip Repair
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Item No.: 6616001817A Ships in 1 - 3 days MOQ: 1
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Specifications
- Brand :N/A
- Color :As Shown
- Gross Weight :0.011kg
- Volume Weight :0.012kg
- Length :9.500cm
- Width :3.600cm
- Height :1.600cm
- Weight :0.010kg
- EAN :
- PackageLength :59.000cm
- PackageWidth :40.000cm
- PackageHeight :35.000cm
- PackageQuantity :1380
- With Retail Packaging :No
Product Description
LANRUI P08 Explosion-Proof Solder Tin Gasket 20x20mm High Temperature Resistant Soldering Pad for Phone CPU IC Chip Repair
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【Explosion-Proof Tin Protection】Specially designed to prevent tin explosion and solder ball splashing during BGA chip soldering processes with hot air guns.
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【Ultra-Clear Glass Coverage】Features high heat resistance ultra-clear glass layer that withstands extreme temperatures and protects the steel mesh underneath.
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【Impact-Resistant Design】Durable construction with impact-resistant glass that maintains integrity even under stress while protecting the tin-plated steel mesh.
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【Anti-Bulging Steel Mesh】Prevents steel mesh deformation and bulging that commonly causes uneven solder application and tin bursting issues.
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【Easy Tin Evaluation】Enables splash-free tinning process, making it easier to assess soldering quality and achieve consistent results.
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【Oxidation Prevention】Protects against oxidation spots under pads that typically make solder application difficult during the tinning process.
Specifications:
- Model: P08
- Dimensions: 20mm x 20mm x 1mm
- Material: Tin-Plated Steel Mesh + Ultra-Clear Glass
Package included:
- 1 x Explosion-Proof Solder Tin Gasket
