BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
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Item No.: 090602552A Ships in 1 - 3 days MOQ: 1
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Specifications
- Condition :OEM
- Parts Type :Others
- Gross Weight :0.010kg
- Volume Weight :0.008kg
- Length :10.000cm
- Width :8.000cm
- Height :0.500cm
- Weight :0.010kg
- EAN :
- With Retail Packaging :Yes
Product Description
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Made by high quality metal material
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9