BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus
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Item No.: 090602543A Ships in 1 - 3 days MOQ: 1
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Specifications
- Condition :OEM
- Parts Type :Others
- Gross Weight :0.011kg
- Volume Weight :0.009kg
- Length :10.000cm
- Width :8.000cm
- Height :0.500cm
- Weight :0.010kg
- EAN :
- With Retail Packaging :Yes
Product Description
BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus
Made by high quality steel material
The stepped grooves can quickly adjust the tin sweating location of IC beads
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template