BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
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Item No.: 6616001565A Ships in 1 - 3 days MOQ: 1
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| $3.06 | $3.02 | $2.97 | $2.91 | $2.84 | $2.80 |
Specifications
- Gross Weight :0.011kg
- Volume Weight :0.005kg
- Length :8.000cm
- Width :6.000cm
- Height :0.500cm
- Weight :0.010kg
- EAN :
- PackageLength :59.000cm
- PackageWidth :40.000cm
- PackageHeight :34.000cm
- PackageQuantity :2200
- With Retail Packaging :No
Product Description
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
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【High-Temperature Resistant】Specially designed adhesive tape capable of withstanding high temperatures, ideal for soldering and chip mounting applications.
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【3D Solder Mask Terminator】Effectively secures and terminates 3D solder masks, ensuring precise chip placement and soldering.
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【Advanced Polymer Material】Utilizes high-quality polymer material for superior durability and performance in electronic assembly processes.
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【Instant Positioning】Features a quick-stick design that allows for immediate and accurate positioning of chips and components.
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【Corrosion Resistant】Provides excellent protection against corrosion, extending the lifespan of mounted chips and electronic components.
Specifications:
- Material: High-polymer, heat-resistant adhesive
- Application: Chip fixation, 3D solder mask termination
- Features: High-temperature resistance, corrosion protection
- Positioning: Instant (one-second) adhesion
- Base Layer: Fire-resistant high-polymer adhesive
Compatible with:
- Universal Models
Package included:
- 1 × Chip Fixing Sticker
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