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BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate
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Item No.: 661600826A Ships in 1 - 3 days MOQ: 5
| 1+ units | 2+ units | 10+ units | 20+ units | 40+ units |
| $13.38 | $13.06 | $12.64 | $12.24 | $12.02 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Gross Weight :0.073kg
- Volume Weight :0.022kg
- Length :11.000cm
- Width :9.000cm
- Height :1.000cm
- Weight :0.065kg
- EAN :
- With Retail Packaging :No
Product Description
BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate
- There is a strong magnet embedded in the base, and strong magnetic adsorption, so that the positioning is accurate, does not deviate, and the magnetism does not change at high temperatures
- High temperature resistant, not easy to deform, non-sticky, easy to get off the net
- Every tin dot is as full as a pearl. Suitable for iPhone 13 series motherboard mid-layer repair
- Strong magnetic adsorption for a tight fit. With precise positioning alignment holes for more convenience
- CNC high-precision integrated processing, stencil and pad precision alignment stable positioning scraping tin ball implantation without deviation
Package included:
- 1 x Set of CPU Soldering Reballing Stencil
