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AMAOE Universal Repair Platform BGA Reballing Stencil Kit Chip Repair Tool for Phone / TV EMMC BGA 153 162 169 186 221 254
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Item No.: 6616001288A Ships in 1 - 3 days MOQ: 1
| 1+ units | 2+ units | 7+ units | 18+ units | 36+ units |
| $26.74 | $26.53 | $26.10 | $25.46 | $25.03 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Gross Weight :0.224kg
- Volume Weight :0.067kg
- Length :15.000cm
- Width :10.000cm
- Height :2.000cm
- Weight :0.200kg
- EAN :
- With Retail Packaging :No
Product Description
AMAOE Universal Repair Platform BGA Reballing Stencil Kit Chip Repair Tool for Phone / TV EMMC BGA 153 162 169 186 221 254
- 【Universal Repair Platform】 Suitable for repairing EMMC BGA chips in various electronic devices including smartphones and TVs.
- 【Versatile BGA Template】 Compatible with multiple BGA configurations including 153, 162, 169, 186, 221, and 254.
- 【Low Magnetic Properties】 Weak to non-magnetic design ensures compatibility with magnetic tin planting stations.
- 【Protective Design】 Safeguards the tin planting net during the repair process.
- 【Professional Tool】 Engineered for chip repair and tin planting tasks in electronic maintenance.
- Compatibility: EMMC BGA 153, 162, 169, 186, 221, 254
- Magnetic Property: Weak to non-magnetic
- Application: Universal repair platform for electronic devices
- Function: Tin planting and chip repair
Package included:
- 1 x Magnet Base
- 2 x Soldering Scraper Blade
- 6 x Soldering Flux Mesh
- 1 x Positioning Plate
- 2 x Adjustment Pieces
