AMAOE For iPhone 17 Series Face ID Solder Stencil 0.12MM BGA Repair Precision Laser Etched Steel Mesh
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Item No.: 6616001694A Ships in 1 - 3 days MOQ: 1
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Specifications
- Gross Weight :0.011kg
- Volume Weight :0.006kg
- Length :9.000cm
- Width :6.000cm
- Height :0.500cm
- Weight :0.010kg
- EAN :
- PackageLength :59.000cm
- PackageWidth :40.000cm
- PackageHeight :35.000cm
- PackageQuantity :1600
- With Retail Packaging :No
Product Description
AMAOE For iPhone 17 Series Face ID Solder Stencil 0.12MM BGA Repair Precision Laser Etched Steel Mesh
- 【Precision Laser-Etched Steel Stencil】High-precision laser etching technology ensures accurate solder paste printing positioning for reliable chip reballing operations.
- 【Specialized Design for iPhone 17 Series】Specifically engineered for iPhone 17 series Face ID module repair, supporting both small board and flex cable reballing processes.
- 【Dual Layout Configuration】Features distinct "Small Board Reballing" and "Flex Cable Reballing" opening layouts to accommodate different repair scenarios and component types.
- 【Professional Grade Thickness】0.12mm face thickness provides optimal solder paste volume control for precise BGA/QFN package chip reballing applications.
- 【High-Precision Repair Support】Dotted line contour openings ensure accurate alignment and easy demolding for professional-grade repair operations.
Specifications:
- Material: Stainless Steel
- Face Thickness: 0.12mm
- Application: BGA/QFN chip reballing
Compatible with:
- iPhone 17 Pro Max
- iPhone 17 Pro
- iPhone 17
- iPhone Air
Package included:
- 1 x Face ID Tin Planting Stencil
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