Update done!
AMAOE EMMC3 BGA Reballing Stencil for BGA162 BGA153 BGA169 BGA221
Rate: ( 0 reviews ) views: 62
Item No.: 6616001595A Ships in 1 - 3 days MOQ: 1
| 1+ units | 3+ units | 15+ units | 40+ units | 100+ units | 200+ units |
| $1.58 | $1.56 | $1.53 | $1.50 | $1.47 | $1.45 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Gross Weight :0.022kg
- Volume Weight :0.006kg
- Length :9.000cm
- Width :6.000cm
- Height :0.500cm
- Weight :0.020kg
- EAN :
- PackageLength :59.000cm
- PackageWidth :40.000cm
- PackageHeight :35.000cm
- PackageQuantity :800
- With Retail Packaging :No
Product Description
AMAOE EMMC3 BGA Reballing Stencil for BGA162 BGA153 BGA169 BGA221
- 【Versatile Compatibility】Designed for EMMC3 BGA, compatible with various models including BGA162, 153, 169, 221, 186, 254, EMCP, and EMMC Memory Flash IC.
- 【Precision Reball Tool】Specialized steel mesh for accurate solder tin planting in BGA rework and repair processes.
- 【Professional Grade】High-quality stencil for EMMC3 chip reballing, ensuring precise solder application.
- 【Heat Resistant】Engineered to withstand high temperatures during the soldering process, maintaining shape and accuracy.
- 【Easy to Use】Facilitates efficient and reliable reballing for both professional technicians and DIY enthusiasts.
Package included:
- 1 x BGA Reballing Stencil
