AMAOE BGA Chip Rework Reballing Stencil Magnetic Positioning Tin Pad for iPhone / Android Phone Repair
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Item No.: 6616001408A Ships in 1 - 3 days MOQ: 1
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$2.23 | $2.20 | $2.17 | $2.12 | $2.08 | $2.05 |
Specifications
- Gross Weight :0.022kg
- Volume Weight :0.018kg
- Length :10.000cm
- Width :8.000cm
- Height :1.000cm
- Weight :0.020kg
- EAN :
- PackageLength :0.000cm
- PackageWidth :0.000cm
- PackageHeight :0.000cm
- PackageQuantity :0
- With Retail Packaging :No
Product Description
AMAOE BGA Chip Rework Reballing Stencil Magnetic Positioning Tin Pad for iPhone / Android Phone Repair
- 【Magnetic Positioning】Steel mesh magnetic leveling system frees up both hands for efficient operation
- 【Versatile Application】Suitable for repairing tin pads on BGA chips in both iOS and Android smartphones
- 【Enhanced Stability】Designed to prevent movement during tin scraping, ensuring more uniform results
- 【Precision Repair】Facilitates accurate and controlled tin pad repair for delicate electronic components
- 【User-Friendly Design】Easy-to-use tool optimized for mobile device repair technicians and enthusiasts
Compatible with:
- Universal Models
Package included:
- 1 x Repair Tin Pad


