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BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
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Item No.: 090602561A Ships in 1 - 3 days MOQ: 1
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| $ 8.51 | $ 8.32 | $ 8.00 | $ 7.74 | $ 7.55 |
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Specifications
- Condition :OEM
- Parts Type :Others
- Gross Weight :0.034kg
- Volume Weight :0.072kg
- Length :10.000cm
- Width :8.000cm
- Height :4.000cm
- Weight :0.030kg
- EAN :
- With Retail Packaging :Yes
Product Description
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
Made by high quality steel material
The stepped grooves can quickly adjust the tin sweating location of IC beads
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Package included:
- 1 x BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template
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