BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
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Specifications
- Retail Packaging :No Package
- User Manual (Language) :No User Manual
- Gross Weight :0.500kg
- Volume Weight :0.060kg
- Length :7.500cm
- Width :6.300cm
- Height :6.300cm
- Weight :0.500kg
- EAN :
- With Retail Packaging :Yes
Product Description
BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
Rosin flux is used to facilitate soldering
It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds
It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process
Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding
Package included:
- 1 x BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream